1. Apply foundational knowledge of semiconductor manufacturing, including wafer processing, lithography, etching, doping, and thin-film deposition.
2. Implement industry-standard safety protocols, cleanroom procedures, and contamination control measures in semiconductor facilities.
3. Evaluate and maintain semiconductor manufacturing equipment, ensuring optimal performance and minimizing downtime.
4. Demonstrate proficiency in semiconductor packaging technologies, including wire bonding, flip-chip, BGA, and advanced packaging methods.
5. Design and troubleshoot PLC-based automation systems used in semiconductor manufacturing and testing.
6. Understand and apply concepts of semiconductor facility maintenance, including HVAC systems, gas management, and cleanroom monitoring.
7. Communicate technical information effectively through reports, presentations, and documentation, following industry standards.
8. Collaborate effectively in a high-tech, cleanroom-based environment, adhering to ethical, safety, and sustainability standards.
9. Utilize modern tools and digital technologies for semiconductor device testing, and automated control.
10. Manage and document process improvement projects, perform technical reporting, and present findings clearly.

Student must be an ITI (2 Years – Engineering Trades) / Diploma (3 Years) passout (2022 or later) with minimum 60% marks or equivalent CGPA and completed 10 th with minimum 50% marks from recognised Board.

Eligible branches for Diploma graduates

Mechanical, Electrical, Electronics, Mechatronics, Instrumentation Control, Electronics and Communication.